One of the mysteries of the English language finally explained.
A chip on one side of which all the connections are in the form of contacts which can be made simultaneously by pressing the chip against the matching substrate and applying heat or pressure.
- ‘The last few years witnessed an explosive growth in the research and development efforts devoted to the solder bumped flip chip as a direct result of the rapid growth of surface mount technology and miniaturization.’
1990s from the fact that the chip is rotated 180 degrees from the traditional mode of attachment.
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